Bisco, Inc introduces the next generation of the industry’s gold standard, ALL-BOND 3, a dual-cured, total-etch, universal adhesive system.
ALL-BOND 3, like the legendary ALL-BOND 2, combines uncompromising performance, universal versatility and superior adhesion. ALL-BOND 3 uses patented technology making it compatible with all dental materials. This hydrophobic material is more durable than other materials currently available. ALL-BOND 3 micro-mechanically bonds to all substrates, is used for all bonding procedures and is compatible with light-, dual- and self-cured materials. ALL-BOND 3 exhibits very low film thickness ensuring direct and indirect restorations are completely seated. The simplified bonding process reduces procedural time.