Bond Force

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Product Description
Bond force is a single component seventh generation self-etching, light cured bonding agent. It displays award winning bond strength after one application and ten seconds cure time. The self-leveling technology allows for a uniform adhesive layer. It is designed to be used for the bonding of light- or dual-cured materials to cut/uncut enamel and dentin.


The self-reinforcing monomer in Bond Force produces a 3D link to the tooth, creating a strong bond to enamel and dentin. Tokuyama introduced Bond Force self-etching dental adhesive in September 2007. This seventh- generation, single-component bonding agent is self-etching and fluoride releasing. Bond Force also contains a patented self-reinforcing (SR) monomer that creates a 3D link between the tooth and enamel and dentin. Bond Force is indicated for bonding of light- or dual-cured composite material to cut or uncut ena...

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Bond Force
Tokuyama Dental America
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