XP BOND Adhesive

XP BOND’s combination of nanofiller particles and unique resin technology provides excellent bond strength and marginal integrity. Its nanofillers are substantially smaller than other leading bonding fillers and deliver a more densely packed bonding matrix, creating optimal marginal integrity, increased adhesion strength, and perfect film thickness in a 1-coat, 1-cure technique. The revolutionary Tertiary—Butanol solvent in XP BOND improves handling and allows clinicians to place a robust, highly filled bond layer. It also mixes with water and resins for greater penetration into moist dentin and collagen and is less volatile in the dish and in drying.

There is no need to light cure the adhesive layer when bonding indirect restorations—mix XP BOND Adhesive with the self-cure activator and use with Dentsply’s dual-cure Calibra Esthetic Resin Cement. If you light cure, you have the confidence of knowing XP BOND Adhesive will completely cure on its own, even if parts of the bonding interface are not exposed to sufficient light. —Jason Schwartz

XP Bond adhesive from Dentsply Caulk, is a unique resin technology with a tertiary-butanol solvent providing a breakthrough in adhesive technology. It offers substantially smaller nanofiller particles to deliver a more densely packed bonding matrix. XP Bond adhesive provides optimal film thickness with excellent visibility and wide wet-to-dry preparation tolerance. It is a universal adhesive that can be used as a lightcure, self-cure, and dual-cure adhesive in combination with the Self-Cure Activator.