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TECO Total-Etch Bonding

Product Description
TECO’s unique dispenser offers reliable bonding with push-button convenience. The bonding material is activated by a simple push on DMG’s patented SilvR single-dose package and may be used immediately. Application with the built-in microbrush is a 1-step, 1-hand, fast, clean, and safe process. Formulated to work with a wet or moist bonding technique, TECO uses the total-etch method to ensure exceptional bond strength and durability. TECO offers a superior microtensile bond strength of 38 Mpa for adhesion to enamel and dentin. TECO’s bonding material is activated by a simple push on DMG’s patented “SilvR” single-dose package and may be used immediately. The built-in microbrush applicator easily slides out of the SilvR dose capsule. Application is a one-step, one-hand, fast, clean and safe process, and its nonacetone formulation works with all curing lights.

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TECO Total-Etch Bonding
DMG America
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